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Shenzhen Chaosheng Electronic Technology Co.,Ltd
Chaosheng Group (Hong Kong) Technology Development Co., Ltd. Shenzhen Chaosheng Electronic Technology Co.,Ltd Zhejiang Kunyu Electronic Technology Co., Ltd. Shenzhen Mingze Electronic Technology Co.,
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Camera Taconic SMT Prototype Assembly , SMT Electronic Assembly IPC-II Standard

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Camera Taconic SMT Prototype Assembly , SMT Electronic Assembly IPC-II Standard

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Brand Name : China chao sheng

Model Number : Six layers of soft and hard PCBA

Place of Origin : Shenzhen, Guangdong, China

MOQ : 1PCS

Price : Negotiation

Payment Terms : T/T, Western Union

Supply Ability : 5-200K/pcs per month

Delivery Time : 20-25day

Packaging Details : Anti-static bag + Anti-static bubble wrap + Good quality carton box

Certification : ISO/UL/RoHS/TS

Board thickness : 1.6mm

Min. line width : 0.075mm/0.1mm(3mil/4mil)

Product name : Camera PCB Assembly

Service : PCB&PCBA

Layer : 1-24layers

Usage : PCB assembly

Pcb standard : IPC-II standard

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Six layers of soft and hard combined production circuit test,wooden box carton packaging,SMT PCB Service,taconic pcb

​Product Description

  1. Six layers of soft and hard combined production + SMT, PCBA wooden box carton packaging,SMT PCB Service,taconic pcb
  2. PCBA processing method
  3. PCB production + it contains SMT, DIP, TEST,
  4. RoHS Lead Free Control Board SMT PCB Assembly 1.6mm PCB Service

    Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

Technical requirement:

  1. Professional surface-mounting and through-hole soldering technology
  2. Various sizes are available, like 1206, 0805, 0603 components SMT technology
  3. ICT (in circuit test), FCT (functional circuit test) technology
  4. PCB assembly with UL, CE, FCC and RoHS approvals
  5. Nitrogen gas reflow soldering technology for SMT
  6. High standard SMT and solder assembly line
  7. High density interconnected board placement technology capacity

Quote requirement:

  1. Gerber file of the bare PCB board
  2. BOM (bill of material) for assembly
  3. To short the lead time, please kindly advise us if there is any acceptable components substitution
  4. Testing guide and test fixtures if necessary
  5. Programming files and programming tool if necessary
  6. Schematic if necessary
  7. OEM/ODM/EMS services for PCBA:
  8. PCBA, PCB assembly: SMT, PTH and BGA
  9. PCBA and enclosure design
  10. Components sourcing and purchasing
  11. Quick prototyping
  12. Plastic injection molding
  13. Metal sheet stamping
  14. Final assembly
  15. Test: AOI, in-circuit test (ICT), functional test (FCT)
  16. Custom clearance for material importing and product exporting

Specifications

  1. Layer: 4 layer
  2. Material: FR4
  3. Board Thickness: 1.6mm
  4. Surface Treatment: Lead free HASL
  5. Solder Mask: Green
  6. Size: 123mm*36mm
  7. Copper Thickness: 1.5oZ
  8. Min. Hole Size: 0.15mm
  9. Min. Line Width: 0.08mm
  10. Min. Line Spacing: 0.08mm
  11. Hole vias: Buried hole and blind hole

Orientronic PCB assembly equipmet

  • Fully automatic SMT stencil printer: FolunGwin Win-5
    • SMT machine: Siemens SIPLACE D1/D2/Siemens SIPLACE S20/F4
    • Reflow oven: FolunGwin FL-RX860
    • Wave soldering machine: FolunGwin ADS300
    • Automated optical inspection (AOI): Aleader ALD-H-350B
  • Needed:
    • PCB gerber file
    • BOM list for PCB assembly
    • Send us your sample PCB board or PCBA
  • Advantages:
    • Turnkey manufacturing or quick-turn prototypes
    • Board-level assembly or complete system integration
    • Low-volume or mixed-technology assembly for PCBA
    • Even consignment production
    • Supported capabilities
  • Type of assembly:
    • THD (thru-hole device)/conventional
    • SMT (surface-mount technology)
    • SMT and THD mixed
    • Double-sided SMT and/or THD assembly
  • Components:
    • Passives, smallest size 0201
    • Fine pitch to 08 Mils
    • Leadless chip carriers/BGA, VFBGA, FPGA and DFN
    • Connectors and terminals
  • Component packaging:
    • Reels
    • Cut tape
    • Tube
    • Loose parts
  • Board dimensions:
    • Smallest size: 0.25 x 0.25 inch/6 x 6mm
    • Largest size: 15.75 x 13.5 inches/400 x 340mm
  • Board shape:
    • Rectangular
    • Round
    • Slots
    • Cutouts
    • Complex
    • Irregular
  • Board type:
    • Rigid
    • Flexible
    • Rigid-flexible
  • Solder type:
    • Leaded and lead-free
    • Water soluble solder paste
    • Manual soldering for special parts, such as wires and temperature sensitive parts
  • Design file format:
    • Gerber RS-274X, 274D, Eagle and AutoCAD’s DXF, DWG
    • BOM (bill of materials)
    • Pick and place file (XYRS)

PCB, FPC process production capability

Technical ltem MassProduct Advanced Technology
2016 2017 2018
Max.Layer Count 26L 36L 80L
Through-hole plate 2～45L 2～60L 2～80L
Max.PCBSize(in) 24*52" 25*62" 25*78.75"
The layer number of FPC 1～36L 1～50L 1～60L
Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
Layeredplatelayer 2～12L 2～18L 2～26L
Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
Combination of hard and soft layers 3～26L 3～30L 3～50L
Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
HDI PCB 4～45L 4～60L 4～80L
Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
Build-up Material FR-4 FR-4 FR-4
BOard,Thickness(mm) Min.12L(mm) 0.43 0.42～8.0mm 0.38～10.0mm
Min.16L(mm) 0.53 1.60～8.0mm 0.45～10.0mm
Min.18L(mm) 0.63 2.0～8.0 0.51～10.0mm
Min.52L(mm) 0.8 2.50～8.0mm 0.65～10.0mm
MAX(mm) 3.5 10.0mm 10.0mm
Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10～254(10.0mm)
Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
Gold thick 1～40u" 1～60u" 1～120u"
Nithick 76～127u" 76～200u" 1～250u"
Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
DieletricThickness 38(1.5) 32(1.3) 32(1.3)
125(5) 125(5) 125(5)
SKipvia Yes Yes Yes
viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
Laser Hole Filling Yes Yes Yes
Technicalltem Mass Product Advanced Technolgy
2017year 2018year 2019year
Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
Min.LineWidth＆space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
BGAPitch mm(Mil) 0.3 0.3 0.3
Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
≦3mil ±0.60 ±0.60 ±0.60
Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
Multi-layer overlay N+N N+N N+N
N+X+N N+X+N N+X+N
sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
PTH filling process PTH resin plug hole + plating fill
Electroplated hole/copper plug hole		 PTH resin plug hole + plating fill
Electroplated hole/copper plug hole		 PTH resin plug hole + plating fill
Electroplated hole/copper plug hole


Product Tags:

surface mount pcb assembly

      

smt prototype assembly

      
Wholesale Camera Taconic SMT Prototype Assembly , SMT Electronic Assembly IPC-II Standard from china suppliers

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